昂科烧录器软件_ V1.05.21(20230304)今日发布-软件更新-烧录器_芯片测试烧录设备_自动ic烧录机_ic烧录测试机

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昂科烧录器软件_ V1.05.21(20230304)今日发布

作者:芯录微半导体发布日期：2023-03-05浏览人数：1723

Hi All：

昂科软件_ V1.05.21(20230304)今日发布，如有需要，请前往官网下载，链接:

下载链接（先注册-登录-再到软件下载中心-下载）https://www.acroview.com/member/login/

A：手动烧录器：AP8000、AP8000F、PT100

B：ic自动烧录机：IPS7000、IPS5000、IPS-MINI PRO、PH-A2000、IPS3000、EAP5000、IPS5100、IPS5200

更新芯片列表如下：

V1.05.21_20230304
Acroview	Programmer Type	Items	Manufacture	Chip Name	Package	Adapter	Description
		New Devices	Actions	ATS2853(SPC1)	QFN48(6x6)	QFN48(6x6)-AG84
			Adesto	AT25SF641-S*B	SO8(210mil)	SO8(210)-AG01
			Allegro	A5931GESTR-T	QFN24(4x4)	QFN24(4x4)-AG03
			Allegro	A5932GESSR-1-T	QFN24(4x4)	QFN24(4x4)-AG06
			Allegro	A5932GESSR-T	QFN24(4x4)	QFN24(4x4)-AG06
			Analogix	ANX7411	QFN28(4x4)	QFN28(4x4)-AG20
			BOSCH	SMA750(ISP-PSI5)	NULL	ISP(SPC)-S19
			Cypress	CY91F526JSE-GSE2	LQFP120(16x16)	TQFP120(16x16)-AG10
			Eastsoft	HR7P170FHS	SO20(300)	SO20(300)-AG18
			Eastsoft	HR7P201FHS	SO20(300)	SO20(300)-AG18
			Eastsoft	HR7P201FHS3	SO16(150)	SO16(150)-AG12
			GigaDevice	GD32FFPRTGU	QFN36(6x6)	QFN36(6x6)-AG01
			GigaDevice	GD25LD80EE	USON8(3x2mm)	DFN8(2x3)-AG01
			GigaDevice	GD25LD80EK	USON8(1.5x1.5)	DFN8(1.5x1.5)-AG01
			GigaDevice	GD25LD80ET	SOP8(150mil)	SO8(150)-AG01
			GigaDevice	GD25WD80EE	USON8(3x2mm)	DFN8(2x3)-AG01
			GigaDevice	GD25WD80EK	USON8(1.5x1.5)	DFN8(1.5x1.5)-AG01
			GigaDevice	GD25WD80ET	SOP8(150mil)	SO8(150)-AG01
			GigaDevice	GD25LF80EE	USON8(3x2mm)	DFN8(2x3)-AG01
			GigaDevice	GD25LF80EN	USON8(3x4mm)	DFN8(3x4)-AG01
			GigaDevice	GD25LF80ES	SOP8(208mil)	SO8(210)-AG01
			GigaDevice	GD32E503RCT	TQFP64(10x10)	TQFP64(10x10)-AG01(F)
			Hisilicon	SD5006RNIV100(P+D)	QFN40(6x6)	QFN40(6x6)-S03
			Hisilicon	SD5006RNIV101(P+D)	QFN48(7x7)	QFN48(7x7)-S42
			Hisilicon	SD5006RNIV101-ICBoard(P+D)	QFN42(17x20)	QFN42(17x20)-S01
			Hisilicon	SD5006RQIV103(P+D)	TQFP64(10x10)	TQFP64(10x10)-S43
			Hisilicon	SD5006RQIV103-ICBoard(P+D)	QFN54(20x22)	QFN54(20x22)-S01
			HYCON	HY16F198B-L064	LQFP64(10x10)	TQFP64(7x7)-AG118
			INDIE	IND83211	QFN48(6x6)	QFN48(6x6)-AG76
			ITE	IT8857FN	QFN56(6x6)	QFN56(6x6)-AG09
			Microchip	PIC16F1823-*/ML	QFN16(4x4)	QFN16(4x4)-AG01
			Microchip	PIC16F1829-*/ML	QFN20(4x4)	QFN20(4x4)-AG01
			MPS	MAC1678GQNT	QFN56(7x7)	QFN56(7x7)-AG35
			MTMicrosystems	MT6AGCS(TEST029)	QFN16(4.8x4.8)	QFN16(4.8x4.8)-AG01
			Numonyx	PC28F128P33B	BGA64(8x10mm)	BGA64(8x10)-AG01
			Numonyx	PC28F128P33B	BGA64(8x10mm)	BGA64(8x10)-AG01(CS)
			NXP	SPC5606BF1*LQ	TQFP144(20x20)	TQFP144(20x20)-AG10
			NXP	FXLS93230(ISP-PSI5)	NULL	ISP(SPC)-S19
			NXP	NCF29A3XHN	QFN32(5x5)	QFN32(5x5)-S32
			NXP	S9S08DZ96F2*LH	TQFP64(10x10)	TQFP64(10x10)-AG08
			Renesas	R7FA2E1A7*CFL	TQFP48(7x7)	TQFP48(7x7)-AG149
			RICHTEK	RT7807N-A	QFN32(4x4)	QFN32(4x4)-AG68
			SanDisk	SDINBDA6-256G	BGA153(11.5x13)	BGA153(11.5x13)-AG01
			ST	MT6AGCS(TEST029)-ST	QFN16(4.8x4.8)	QFN16(4.8x4.8)-AG01
			ST	STM32WB55*G(FUS+BLEStack+APP+Option)(ISP-SWD-3V-SPC0022)	NULL	ISP-AG08
			ST	STM32F103VGT	LQFP100(14x14)	TQFP100(14x14)-AG07(F)(CS)
			TI	BQ27500	QFN12(4x2.5)	QFN12(4x2.5)-AG02
			TI	TPS536C7(HEX)	QFN48(6x6)	QFN48(6x6)-AG46
			TI	TMS320F28035(ISP-JTAG-3.3VTTL-3.3V)	NULL	JTAG(C2000)-S01
			Toshiba	THGBMJG6C1LBAU7	BGA153(11.5x13)	BGA153(11.5x13)-AG01
			YMTC	YMEC7BOTE1A2C3	BGA153(11.5x13)	BGA153(11.5x13)-AG01
		Update Devices	cFeon	EN25QH16B-***H	SOP8(200mil)	SO8(210)-AG01	Update: After burning CMP, there is no way to re-burn the flash area

							(Must carefully confirm config option and redo project load burning)
			Cypress	CYPD5225-96BZX	BGA96(6x6)	BGA96(6x6)-S02	Update: Solve the problem that some chips fail to enter mode and the data is changed after burning customer files

							(Must carefully confirm config option and redo project load burning)
			elmos	E52417A(SPC)	QFN20(5x5)	QFN20(5x5)-AG04	Update: To solve the problem of burning CC address data is not correct, add Secure Verify

							(Must carefully confirm config option and redo project load burning)
			GigaDevice	GD32F470ZGT	TQFP144(20x20)	TQFP144(20x20)-AG06	Update: Fix stability issues and speed up

							(Must carefully confirm config option and redo project load burning)
iCommSemi	SV32WB01L		QFN32(4x4)	QFN32(4x4)-AG43	Update: Solve the problem of CHECKSUM failure when customers burn SV32WB01L chip files larger than 1M

					(Must carefully confirm config option and redo project load burning)
KIOXIA	TC58CYG1S3HRAIJ		WSON8(8x6mm)	VPDFN8(8x6)-AG01	Update: Fixed number of blocks and buffer range

					(Must carefully confirm config option and redo project load burning)
Microchip	dsPIC33CK256MP503(SINGLE)		QFN36(5x5)	QFN36(5x5)-AG01	Update: Solve some chip burning failure problem

					(Must carefully confirm config option and redo project load burning)
Microchip	ATSAME51J18A-A		TQFP64(10x10)	TQFP64(10x10)-AG80	Update: Solve the Reserved bit does not burn no check problem

					(Must carefully confirm config option and redo project load burning)
MPS	MP2845BGQK		QFN56(6x6)	QFN56(6x6)-AG08	What's New: Modified the Check ID flow and password processing flow

					(Must carefully confirm config option and redo project load burning)
Nation	N32G435CBL		TQFP48(7x7)	TQFP48(7x7)-AG73	Update: Resolve erasing failure and report check failure when burning

					(Must carefully confirm config option and redo project load burning)
NXP	MC33PF8200A0ES		QFN56(8x8)	QFN56(8x8)-AG06	Update: Add UID read

					(Must carefully confirm config option and redo project load burning)
NXP	MC33PF8100A0ES		QFN56(8x8)	QFN56(8x8)-S05	Update: Add UID read

					(Must carefully confirm config option and redo project load burning)
NXP	MC34PF8100A0EP		QFN56(8x8)	QFN56(8x8)-S05	Update: Add UID read

					(Must carefully confirm config option and redo project load burning)
NXP	S32K314EHT1*PB		MAXQFP172(16x16)	MAXQFP172(16x16)-AG01	Update: Solve the problem of checking failure when burning

					(Must carefully confirm config option and redo project load burning)
Realtek	RTL8762DK		QFN48(6x6)	QFN48(6x6)-S28	Update: Solve the problem of unstable burning

					(Must carefully confirm config option and redo project load burning)
Renesas	R7F701649*AFP		PQFP176(24x24)	PQFP176(24x24)-4-AG29	Update: Customer part of the material erasure failed

					(Must carefully confirm config option and redo project load burning)
Renesas	R7F701374A*AFP		LQFP144	TQFP144(16x16)-AG02	New: Added functions of Code ID and Data ID

					(Must carefully confirm config option and redo project load burning)
Winbond	W25N01GWZEIG		WSON8(8x6mm)	VPDFN8(8x6)-AG01	Update: Fixed multiple seat son erasing bad block failure

					(Must carefully confirm config option and redo project load burning)
Winbond	W25Q128JVSIM		SOIC8(208mil)	SO8(210)-AG01	New: Changed the default QE value

					(Must carefully confirm config option and redo project load burning)
GUI modifcations	V1.4.11(20230220) 1、取消”Intel Hex”限制，可以对所有档案解析负偏移
Firmware modifications
MultiAprog modifications	V1.2.99(20230223) 1、多站点初始化由串行改成并行，加快启动速度 2、新增对Bottom Board-AG07的支持

------------------Best wishes--------------------

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