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昂科烧录器软件_ V1.05.23(20230401)正式版本发布通知

作者:芯录微半导体发布日期:2023-04-01浏览人数:2387

Dear All:

昂科软件_ V1.05.23(20230401)今日发布,如有需要,请前往官网下载,链接:

下载链接(先注册-登录-再到软件下载中心-下载)https://www.acroview.com/member/login/


烧录器软件适用机型:

A:手动烧录器:AP8000、AP8000F、PT100

B:全自动烧录器:IPS7000、IPS5000、IPS-MINI PRO、PH-A2000、IPS3000、EAP5000、IPS5100、IPS5200


更新芯片列表如下:

                                                                    V1.05.23_20230401
AcroviewProgrammer TypeItemsManufactureChip NamePackageAdapterDescription
New DevicesAltera10M04SCU169(POF)BGA169(11x11)BGA169(11x11)-AG01
Altera10M08SCU169(POF)BGA169(11x11)BGA169(11x11)-AG01
ArteryTekAT32F407VGTLQFP100(14x14)TQFP100(14x14)-AG07(F)
AtmelATSAM3S1BB-AUTQFP64(10x10)TQFP64(10x10)-AG69
C-CoreCCFC2012BC60L5TQFP144(20x20)TQFP144(20x20)-AG98
CypressCY8C4245LQ*-483QFN40(6x6)QFN40(6x6)-AG21
CypressCY91F526JSE-GSE2(ALP)LQFP120(16x16)TQFP120(16x16)-AG10
CypressS6J336CHTBTQFP144(16x16)TQFP144(16x16)-AG03
CypressS6J336CHTB(ALP)TQFP144(16x16)TQFP144(16x16)-AG03
CypressS6J342AFTBTQFP100(14x14)TQFP100(14x14)-AG158
CypressS6J342AFTB(ALP)TQFP100(14x14)TQFP100(14x14)-AG158
EONEN25S32A-*XFUSON8(2x3mm)DFN8(2x3)-AG01
FORESEEFEMDRM008G-58A39BGA153(11.5x13)BGA153(11.5x13)-AG01
FudanWeiFM33A048EVLQFP80(12x12)PQFP80(12x12)-AG18
GigaDeviceGD32F307VGTLQFP100(14x14)TQFP100(14x14)-AG07(F)
GOWINGW1N-UV2QN32QFN32(5x5)QFN32(5x5)-AG129
GOWINGW1N-UV4PG256BGA256(17x17)BGA256(17x17)-AG16
HDSCHC32F003C4PTSSOP20(4.4x6.5)TSSOP20(4.4x6.5)-AG05
HolyChipHC89S003BTSSOP20(4.4x6.5)TSSOP20(4.4x6.5)-AG33
INGCHIPSING91880CQFN32(4x4)QFN32(4x4)-AG71
LatticeLCMXO3LF-2100E-*MG121csfBGA121(6x6)BGA121(6x6)-S01
LatticeLCMXO3LF-2100E-*MG121BGA121(6x6)BGA121(6x6)-AG01
LatticeLCMXO2280C-*FTN324BGA324(19x19)BGA324(19x19)-S04
MacronixMX25L128356MSO16(300mil)SO16(300)-AG01
MacronixMX25L128356M2SOP8(208mil)SO8(210)-AG01
MacronixMX25L128356Z2WSON8(8x6mm)VPDFN8(8x6)-AG01
MacronixMX25L128356ZNWSON8(6x5mm)VPDFN8(6x5)-AG01
MacronixMX25LM25645GXDTFBGA 6x8 24ball(5x5 ball array)TBGA24(8x6)-AG01
MacronixMX25LW51245GXDTFBGA 6x8 24ball(5x5 ball array)TBGA24(8x6)-AG01
MacronixMX25U16356ZCXSON8(4x4mm)DFN8(4x4)-AG01
MacronixMX25U16356ZNWSON8(6x5mm)VPDFN8(6x5)-AG01
MacronixMX25U51241GMSOP16(300mil)SO16(300)-AG01
MacronixMX25U51241GXDBGA24(6x8mm,5x5 BallArray)TBGA24(8x6)-AG01
MacronixMX25U51241GZ4WSON8(8x6mm)VPDFN8(8x6)-AG01
MacronixMX25UM51245GXXTFBGA 6x8 24ball(5x5 ball array)TBGA24(8x6)-AG01
MacronixMX66L1G45JMSOP16(300mil)SO16(300)-AG01
MacronixMX66L1G45JXDBGA24(6x8mm,5x5 BallArray)TBGA24(8x6)-AG01
MacronixMX66L1G45JZ4WSON8(8x6mm)VPDFN8(8x6)-AG01
MacronixMX66L1G65GMSOP16(300mil)SO16(300)-AG01
MacronixMX77U25655FMSOP16(300mil)SO16(300)-AG01
MacronixMX77U25655FZ4WSON8(8x6mm)VPDFN8(8x6)-AG01
MacronixMX77U51255FMSOP16(300mil)SO16(300)-AG01
MacronixMX77U51255FZ4WSON8(8x6mm)VPDFN8(8x6)-AG01
MicrochipATSAML11E15ATQFP32(7x7)TQFP32(7x7)-AG67
MicrochipATSAMD21J18A-MQFN64(9x9)QFN64(9x9)-AG22
Microchip25LC040A-*/SN(DLY30S)SOP8(150mil)SO8(150)-AG01
MPSMP6616GDQFN10(2x3)QFN10(2x3)-AG01
NationN32L406CBLLQFP48(7x7)TQFP48(7x7)-AG07CVT-AG01
PUYAP25Q32SN-NXUSON8(3x4mm)DFN8(3x4)-AG01
PUYAP25Q32SN-SSSO8(150mil)SO8(150)-AG01
PUYAP25Q32SN-SUSO8(208mil)SO8(210)-AG01
PUYAP25Q32SN-TSTSSOP8TSSOP8-AG02
PUYAP25Q32SN-UXUSON8(3x2mm)DFN8(2x3)-AG01
PUYAP25Q32SN-WXWSON8(6x5mm)VPDFN8(6x5)-AG01
RaydiumRM23011QFN20(3.5x3.5)QFN20(3.5x3.5)-AG01
RaysonRS70B16G4S10FBGA153(11.5x13)BGA153(11.5x13)-AG01
RenergyRN8217(Option)LQFP100(14x14)TQFP100(14x14)-AG141
RenesasR5F10RJC*FATQFP52(10x10)TQFP52(10x10)-AG03
RenesasR7FA2A1AB*CFMTQFP64(10x10)TQFP64(10x10)-AG163
RICHTEKRT7860QFN48(6x6)QFN48(6x6)-AG85
RICHTEKRT3635BE-03QFN60(7x7)QFN60(7x7)-AG05
SanDiskSDINBDV4-32GBGA153(11.5x13)BGA153(11.5x13)-AG01
SanDiskSDINBDV4-64GBGA153(11.5x13)BGA153(11.5x13)-AG01
SanDiskSDINBDA6-16GBGA153(11.5x13)BGA153(11.5x13)-AG01
Silicon LaboratoriesEFM8BB31F32*-D-QFN32QFN32(4x4)QFN32(4x4)-AG03
SPINTROLSPC1168(ISP-SWD-3.3VTTL-3.3V)NULLISP-S01
STSTM32L431CBTTQFP48(7x7)TQFP48(7x7)-AG05
STSTM32F205RETTQFP64(10x10)TQFP64(10x10)-AG01(K)
STSTM32L031G6UQFN28(4x4)QFN28(4x4)-AG18
STSTM32G491CCTTQFP48(7x7)TQFP48(7x7)-AG85
STSTM32G474CBT(ENTEDRV9)LQFP48(7x7)TQFP48(7x7)-AG85
STSTM32G474CBT(Optimizer)LQFP48(7x7)TQFP48(7x7)-AG85
STCSTC15W4K48S4-30*-LQFP32LQFP32(7x7)TQFP32(7x7)-S56
STCSTC15W4K48S4-30*-LQFP48LQFP48TQFP48(7x7)-S156
TITMS320F28035(ISP-JTAG-3.3VTTL-3.3V)NULLJTAG(C2000)-CVT01-S01
WinbondW25Q20CLSNSOIC8(150mil)SO8(150)-AG01
WinbondW25Q20CLSVVSOP8(150mil)SO8(150)-AG01
WinbondW25Q20CLUXUSON8(2x3mm)DFN8(2x3)-AG01
WinbondW25Q20CLZPWSON8(6x5mm)VPDFN8(6x5)-AG01
X-SignalIntegratedXM2616QFN24(4x4)QFN24(4x4)-AG56
Update DevicesHEDHD8040BWLCSP48(2.780x2.933)WLCSP48(2.780x2.933)-S01Update: Fix the software stuck exception when pressing the program

(You must carefully confirm the config option and redo the project to load and burn)
AlteraEPM1270T144*5N(POF)TQFP144(20x20)TQFP144(20x20)-AG11Update: Added TAG17 checksum display.

(You must carefully confirm the config option and redo the project to load and burn)
ChipOn(KungFu)KF32A141IQSTQFP48(7x7)TQFP48(7x7)-AG106Update: Fixed the failure of some chips to burn into mode

(You must carefully confirm the config option and redo the project to load and burn)
GMTKA731QFN40(5x5) 0.4QFN40(5x5)-AG25Update: Solve the yield problem of some batches

(You must carefully confirm the config option and redo the project to load and burn)
HOLTEKHT50F83(ISP-ICP-4.5VTTL-5.0V)NULLISP-AG08Update: Changed seat ISP-AG17 to ISP-AG08

(You must carefully confirm the config option and reload the project burn)
ISSIIS25LP064D-JBSOIC8(208mil)SO8(210)-AG01Update: Added checksum reverse display

(You must carefully confirm the config option and redo the project to load and burn)
MicrochipdsPIC33EP256MC206-*/MRQFN64(9x9)QFN64(9x9)-AG05Update: Speed up

(You must carefully confirm the config option and redo the project to load and burn)
MicronMTFC4GACAJCN-1MBGA153(11.5x13)BGA153(11.5x13)-AG01Update: Update the algorithm

(You must carefully confirm the config option and redo the project to load and burn)
MPSHR1211GYSO20(300)SO20(300)-AG17Update: Added CRC Check Fail print

(You must carefully confirm the config option and redo the project to load and burn)
RICHTEKRTQ6751GQWT(TRIM)QFN40(6x6)QFN40(6x6)-AG24Update: Modified config

(You must carefully confirm the config option and redo the project to load and burn)
RICHTEKRT7083(ISP-IIC-5VTTL-5V)NULLISP-AG17Update: Changed chip name

(You must carefully confirm the config option and reload the project burn)
RICHTEK RT7807N-AQFN32(4x4)QFN32(4x4)-AG68Update: Modified according to the latest manual, the modified content is the length of ID check, and more mask value to determine whether the corresponding value is tested

(You must carefully confirm the config option and redo the project to load and burn)
SinoWealthSH32F9062*P_044PR(NOPF)LQFP44(10x10)LQFP44(10x10)-AG45Update: Solve the problem of burning customer files, empty chip 20% bad, and file running

(You must carefully confirm the config option and redo the project to load and burn)
STSTM8S003F3UUFQFPN20(3x3)QFN20(3x3)-AG02Update: Added option checksum display

(You must carefully confirm the config option and reload the project burn)
ToshibaTH58NYG3S0HBAI4P-TFBGA63-0911-0.80CZ(9x11)BGA63(9x11)-AG01Update: Resolve the verify fail issue

(You must carefully confirm the config option and redo the project to load and burn)
WinbondW25Q16JVSS*Q(ISP)NULLISP-S01Update: Added UID function

(You must carefully confirm the config option and redo the project to load and burn)
GUI modifcationsV1.4.18  1.非标准Hex档案,比如有多个结束符,提示用户错误还是继续解析
Firmware modifications
MultiAprog modificationsV1.3.10  1.加快MesClientApp退出速度  2.修改电子检测打开后,发送Cmd3失败,然后stdmes在stopservice卡死的问题


------------------Best wishes--------------------



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