Zetta-芯片厂商-芯录微_芯片测试烧录设备_自动ic烧录机_ic烧录测试机_驻厂ic代烧录-芯录微半导体（苏州）有限公司

Zetta

ZD25D16S[SOP8(208mil)]@SO8(210)-AG01

ZD25D16T[SOP8(150mil)]@SO8(150)-AG01

ZD25D20S[SOP8(208mil)]@SO8(210)-AG01

ZD25D20T[SOP8(150mil)]@SO8(150)-AG01

ZD25D40S[SOP8(208mil)]@SO8(210)-AG01

ZD25D40T[SOP8(150mil)]@SO8(150)-AG01

ZD25D80S[SOP8(208mil)]@SO8(210)-AG01

ZD25D80T[SOP8(150mil)]@SO8(150)-AG01

ZD35M1GA-*A[SOP16(300mil)]@SO16(300)-AG01

ZD35M1GA-*B[WSON8(8x6mm)]@VPDFN8(8x6)-AG01

ZD35M1GA-*C[TFBGA24 8x6mm(6x4 ball array)]@TBGA24(8x6mm 6x4Ball)-AG01

ZD35M1GA-*C[TFBGA24 8x6mm(6x4 ball array)]@TBGA24(8x6mm 6x4Ball)-AG01(CS)

ZD35M2GA-*A[SOP16(300mil)]@SO16(300)-AG01

ZD35M2GA-*B[WSON8(8x6mm)]@VPDFN8(8x6)-AG01

ZD35M2GA-*C[TFBGA24 8x6mm(6x4 ball array)]@TBGA24(8x6mm 6x4Ball)-AG01

ZD35M2GA-*C[TFBGA24 8x6mm(6x4 ball array)]@TBGA24(8x6mm 6x4Ball)-AG01(CS)

ZD35Q1GA-*A[SOP16(300mil)]@SO16(300)-AG01

ZD35Q1GA-*B[WSON8(8x6mm)]@VPDFN8(8x6)-AG01

ZD35Q1GA-*C[TFBGA24 8x6mm(6x4 ball array)]@TBGA24(8x6mm 6x4Ball)-AG01

ZD35Q1GA-*C[TFBGA24 8x6mm(6x4 ball array)]@TBGA24(8x6mm 6x4Ball)-AG01(CS)

ZD35Q2GA-*A[SOP16(300mil)]@SO16(300)-AG01

ZD35Q2GA-*B[WSON8(8x6mm)]@VPDFN8(8x6)-AG01

ZD35Q2GA-*C[TFBGA24 8x6mm(6x4 ball array)]@TBGA24(8x6mm 6x4Ball)-AG01

ZD35Q2GA-*C[TFBGA24 8x6mm(6x4 ball array)]@TBGA24(8x6mm 6x4Ball)-AG01(CS)

ZDND1G08S3D-*A[TSOP48]@TSOP48(12x20)-AG01

ZDND1G08S3D-*D[BGA63(9x11mm)]@BGA63(9x11)-AG01(CS)

ZDND1G08S3D-*D[BGA63(9x11mm)]@BGA63(9x11)-AG01

ZDND1G08S3D-*E[BGA67(6.5x8mm)]@VFBGA48(8x6.5)-AG01

ZDND1G08U3D-*A[TSOP48]@TSOP48(12x20)-AG01

ZDND1G08U3D-*D[BGA63(9x11mm)]@BGA63(9x11)-AG01(CS)

ZDND1G08U3D-*D[BGA63(9x11mm)]@BGA63(9x11)-AG01

ZDND1G08U3D-*E[BGA67(6.5x8mm)]@VFBGA48(8x6.5)-AG01

ZDND1G16S3D-*A[TSOP48]@TSOP48(12x20)-AG01

ZDND1G16S3D-*D[BGA63(9x11mm)]@BGA63(9x11)-AG01(CS)

ZDND1G16S3D-*D[BGA63(9x11mm)]@BGA63(9x11)-AG01

ZDND1G16S3D-*E[BGA67(6.5x8mm)]@VFBGA48(8x6.5)-AG01

ZDND1G16U3D-*A[TSOP48]@TSOP48(12x20)-AG01

ZDND1G16U3D-*D[BGA63(9x11mm)]@BGA63(9x11)-AG01(CS)

ZDND1G16U3D-*D[BGA63(9x11mm)]@BGA63(9x11)-AG01

ZDND1G16U3D-*E[BGA67(6.5x8mm)]@VFBGA48(8x6.5)-AG01

ZDND2G08S3D-*A[TSOP48]@TSOP48(12x20)-AG01

ZDND2G08S3D-*D[BGA63(9x11mm)]@BGA63(9x11)-AG01(CS)

ZDND2G08S3D-*D[BGA63(9x11mm)]@BGA63(9x11)-AG01

ZDND2G08S3D-*E[BGA67(6.5x8mm)]@VFBGA48(8x6.5)-AG01

ZDND2G08U3D-*A[TSOP48]@TSOP48(12x20)-AG01

ZDND2G08U3D-*D[BGA63(9x11mm)]@BGA63(9x11)-AG01(CS)

ZDND2G08U3D-*D[BGA63(9x11mm)]@BGA63(9x11)-AG01

ZDND2G08U3D-*E[BGA67(6.5x8mm)]@VFBGA48(8x6.5)-AG01

ZDND2G16S3D-*A[TSOP48]@TSOP48(12x20)-AG01

ZDND2G16S3D-*D[BGA63(9x11mm)]@BGA63(9x11)-AG01(CS)

ZDND2G16S3D-*D[BGA63(9x11mm)]@BGA63(9x11)-AG01

ZDND2G16S3D-*E[BGA67(6.5x8mm)]@VFBGA48(8x6.5)-AG01

ZDND2G16U3D-*A[TSOP48]@TSOP48(12x20)-AG01

ZDND2G16U3D-*D[BGA63(9x11mm)]@BGA63(9x11)-AG01(CS)

ZDND2G16U3D-*D[BGA63(9x11mm)]@BGA63(9x11)-AG01

ZDND2G16U3D-*E[BGA67(6.5x8mm)]@VFBGA48(8x6.5)-AG01

ZD25Q16S[SOP8(208mil)]@SO8(210)-AG01

ZD25Q16T[SOP8(150mil)]@SO8(150)-AG01

ZD25Q16U[USON8(3x2)]@DFN8(2x3)-AG01

ZD25Q32E[USON8(3x4mm)]@DFN8(3x4)-AG01

ZD25Q32S[SO8(208mil)]@SO8(210)-AG01

ZD25Q32T[SO8(150mil)]@SO8(150)-AG01

ZD25Q40S[SOP8(208mil)]@SO8(210)-AG01

ZD25Q40T[SOP8(150mil)]@SO8(150)-AG01

ZD25Q40U[USON8(3x2mm)]@DFN8(2x3)-AG01

ZD25Q64S[SOP8(208mil)]@SO8(210)-AG01

ZD25Q64W[WSON8(6x5mm)]@VPDFN8(6x5)-AG01

ZD24C128A-SS[SO8(150mil)]@SO8(150)-AG03

ZD24C128A-X[TSSOP8]@TSSOP8-AG01

ZD24C32A-SS[SO8(150mil)]@SO8(150)-AG03

ZD24C32A-X[TSSOP8]@TSSOP8-AG01

ZD24C64A-SS[SO8(150mil)]@SO8(150)-AG03

ZD24C64A-X[TSSOP8]@TSSOP8-AG01

Total Num : 73

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产品介绍

自动烧录机IPS5800S

概要：IPS5800S是高性能自动烧录机，采用四吸嘴取料、放料结构，UPH高达3500；可搭载8台昂科技术通用烧录器A8000，系统最多可扩充至64个或128个烧录工位。适应大量电子产品生产而设计的一款高性价比的全自动智能化IC编程设备，支持CSP、WLCSP和小尺寸封装烧录，如1.0x1.5mm尺寸IC，并且透过更进阶的功能提供全方位自动化烧录的解决方案
昂科AP8000高速通用编程器是最新一款专业智能通用编程器/烧录器/烧写器。强大的器件算法库，支持器件数量持续增加中，最新软件可以在官网下载。